Fast wafer inspection

Image: Precitec-Optronik GmbH

For bow, warp, TTV and quality inspection of semiconductor wafers in shorter cycle times Precitec has launched the ultra-fast Flying Spot Scanner (FSS) 310. Its features include flexible scan trajectories, the ability to measure 12″ wafers and a Z resolution in the nm range. The system combines OCT with wide FoV scanning and solves the issue of ultra-precise measuring systems normally working very slowly and being extremely expensive. Thanks to its huge scan area of 310mm, the FSS 310 will measure the total thickness variation (TTV), bow and warp of an entire 12-inch wafer and detect any voids in a single scan – in less than 10 seconds per wafer for standard applications.

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